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Process Literature

Capabilities
Equipment
Process Literature
Recipes

Process Notes

  • Notes for Troubleshooting Alignments
  • MEMS_runsheet
  • PlasmaThermRecipes

Measurement results

  • EEC146A Electrical Characterization Measurements (Updated on Dec 11, 2015)
  • Fall 2015 EEC146A Measurement results
  • Spring 2017 EEC146A Measurement results

Photoresist Adhesion

  • Substrate Cleaning and Adhesion
  • Resist Adhesion
  • Process Startup and Optimization

Photoresist processing

  • Spin Coating
  • Softbake
  • Photoresist Optical Parameters
  • Photoresist baking
  • Photoresist coating
  • Hardbake
  • Exposure

Development

  • Solvents
  • Resists Developer Removers
  • Photoresist Removal
  • Development Photoresist

Fabrication Notes

  • Lithography Trouble-shooting
  • Lift-off
  • Reflow
  • Grey-scale Lithography

Photoresist Information

  • Photoresist Storage Aging, Refilling, and Dilution
  • High-Resolution Photoresist Processing
  • Photoresist Rehydration
  • General Properties of AZ/TI Photoresists

Etching

  • Wet Chemical Etching
  • HF Etching
  • Gold Etching
  • Dry Etching Photoresist
  • Aluminum Etching
  • Chromium Etchinge
  • Silicon Etching

Specialty Photoresist Information

  • Laser Exposure of Photoresists
  • Electroplating Photoresists
  • AZ nLOF 20xx Negative Resist
  • Image Reversal Resists
  • Spray Coating Resist
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