- Additional or repeated training may be required if the staff notes user deficiencies.
- Times are approximate, and actual staff training time will be billed per user.
- Note 1: No formal Staff Training is required.
- Note 2: Staff can include shadowing of up to 2 additional people
|
Badger Name |
Equipment |
Training Contact |
Approx. Training Hours (Hrs) |
Max. User per training |
| General Training Sessions | ||||
| Safety Tour | Paula | 1 | 3 | |
| Photolithography | Yusha | 0.5 – 1 | 3 | |
| Acid Bench | Ed | 2 | 2 | |
| Solvent Bench | Yusha | 0.5 – 1 | 3 | |
| KOH | Ed | 1 | 2 | |
| Lithography, South | ||||
| Brewer1 | Brewer CEE Model 100 Spinner | Yusha | 0.5 – 1 | 3 |
| Solitec1_ncnc, Solitec2_ncnc | Solitec 5110-CT Spinner Hotplate | Yusha | 0.5 – 1 | 3 |
| Ksuss_MA4_1_ncnc, Ksuss_MA4_2_ncnc | Karl Suss MA4 Aligner | Yusha | 1-2 | 2 |
| EVG 620 Mask_Bond Aligner | EVG 620 Mask Aligner | Yusha | 1-2 | 2 |
| DEPOSITION | ||||
| CHA-Ebeam_ncnc | CHA AutoTech II E-Beam Evaporator | Chan | 3+3 (two sessions) | 2 |
| CHA_Sputter_ncnc | CHA MPS-4 Sputter | Chan | Not Ready | |
| Lesker_Sputter_ncnc | Lesker Labline Sputter | Chan | ■ Metal Deposition: 3+3 (two sessions) | 1 |
| Chan | ■ Reactive Sputtering: 3+3+3 (three sessions) | 1 | ||
| ETCHING | ||||
| Plasmatherm790_RIE_ncnc | PlasmaTherm 790 Series | Yusha | 1 | 2 |
| Technics_RIE_ncnc | Plasma Equip. Tech. Services (PETS) RIE | Yusha | 1 | 2 |
| Xactix_XeF2_Etch_ncnc | SPTS XactiX e1 | Ed | 0.5 | 3 |
| Canon_2_ncnc | DPSS Laser | 1 | 2 | |
| ANALYTICAL | ||||
| Dektak XT | Bruker Decktak XT | Ed | 0.5 | 3 |
| Nanometrics_ncnc | Nanospec AFT | Note1 | ||
| Dektak 3ST | Dektak 3ST Surface Profilometer | Ed | 0.5 | 3 |
| Ellipsometer | J.A. Woollam M-2000 | Ed | 1 | 2 |
| THERMAL AND GROWTH | ||||
| Rapid_Thermal_Processer | Allwin AW610 | Ed | 0.75 | 2 |
| Programmable Oven | Yamato Scientific America DP63 | Ed | 0.5 | 3 |
| PACKAGING | ||||
| Dicing Saw_ncnc | Disco DAD 321 Dicing Saw | Chan | 3+3 (two sessions) | 1 |
| CPD_1_ncnc | Tousimis Autosamdri-815 | Yusha | 0.5 | 1 |
| EVG 501 Bonder | EVG 501 Bonder | Yusha | 0.75 | 1 |
| EVG 810 Plasma Activation | EVG 810 Plasma Activation | Yusha | 0.5 | 1 |
| CLEANING AND PREPARATION | ||||
| Spin_Rinse_Dryer_3_ncnc | Semitool PSC-101 | Yusha | 0.25 | |
| ELECTRON MICROSCOPY | ||||
| FEI_NanoSEM_ncnc | FEI 430 NanoSEM | Ed | 2 + 2 | 1 (Note 2) |
| NPGS EBL system | Electron Beam lithography includes sample prep, dev, characterization | 4 + 4 + 2 | 1 (Note 2) | |
| FEI_Scios_FIB_ncnc | FEI Scios DualBeam SEM/FIB | Andrew | 4-12 (process dependent) | 1 (Note 2) |
| Oxford EDS/EBSD | EDS and EBSD materials characterization | Andrew | 2 + 2 | 1 (Note 2) |
| Gold_Carbon Sputter Coater | Quorum Tech Q150RES | Ed | 0.25 | 1 (Note 2) |
| ELECTRICAL TEST | ||||
| Probe Station | Yusha | 0.5 | 1 | |
| CV Plotter | Yusha | 0.5 | 1 |
