Training Matrix

  • Additional or repeated training may be required if the staff notes user deficiencies.
  • Times are approximate, and actual staff training time will be billed per user.
  • Note 1: No formal Staff Training is required.
  • Note 2: Staff can include shadowing of up to 2 additional people

Badger Name

Equipment

Training Contact

Approx. Training Hours (Hrs)

Max. User per training

General Training Sessions
Safety Tour Paula 1 3
Photolithography Yusha 0.5 – 1 3
Acid Bench Ed 2 2
Solvent Bench Yusha 0.5 – 1 3
KOH Ed 1 2
Lithography, South
Brewer1 Brewer CEE Model 100 Spinner Yusha 0.5 – 1 3
Solitec1_ncnc, Solitec2_ncnc Solitec 5110-CT Spinner Hotplate Yusha 0.5 – 1 3
Ksuss_MA4_1_ncnc, Ksuss_MA4_2_ncnc Karl Suss MA4 Aligner Yusha 1-2 2
EVG 620 Mask_Bond Aligner EVG 620 Mask Aligner Yusha 1-2 2
DEPOSITION
CHA-Ebeam_ncnc CHA AutoTech II E-Beam Evaporator Chan 3+3 (two sessions) 2
CHA_Sputter_ncnc CHA MPS-4 Sputter Chan Not Ready
Lesker_Sputter_ncnc Lesker Labline Sputter Chan ■ Metal Deposition: 3+3 (two sessions) 1
Chan ■ Reactive Sputtering: 3+3+3 (three sessions) 1
ETCHING
Plasmatherm790_RIE_ncnc PlasmaTherm 790 Series Yusha 1 2
Technics_RIE_ncnc Plasma Equip. Tech. Services (PETS) RIE Yusha 1 2
Xactix_XeF2_Etch_ncnc SPTS XactiX e1 Ed 0.5 3
Canon_2_ncnc DPSS Laser Rijuta 1 2
ANALYTICAL
Dektak XT Bruker Decktak XT Ed 0.5 3
Nanometrics_ncnc Nanospec AFT Note1
Dektak 3ST Dektak 3ST Surface Profilometer Ed 0.5 3
Ellipsometer J.A. Woollam M-2000 Ed 1 2
THERMAL AND GROWTH
Rapid_Thermal_Processer Allwin AW610 Ed 0.75 2
Programmable Oven Yamato Scientific America DP63 Ed 0.5 3
PACKAGING
Dicing Saw_ncnc Disco DAD 321 Dicing Saw Chan 3+3 (two sessions) 1
CPD_1_ncnc Tousimis Autosamdri-815 Yusha 0.5 1
EVG 501 Bonder EVG 501 Bonder Yusha 0.75 1
EVG 810 Plasma Activation EVG 810 Plasma Activation Yusha 0.5 1
CLEANING AND PREPARATION
Spin_Rinse_Dryer_3_ncnc Semitool PSC-101 Yusha 0.25
ELECTRON MICROSCOPY
FEI_NanoSEM_ncnc FEI 430 NanoSEM Rijuta 2 + 2 1 (Note 2)
NPGS EBL system Electron Beam lithography includes sample prep, dev, characterization Rijuta 4 + 4 + 2 1 (Note 2)
FEI_Scios_FIB_ncnc FEI Scios DualBeam SEM/FIB Rijuta 4-12 (process dependent) 1 (Note 2)
Oxford EDS/EBSD EDS and EBSD materials characterization Rijuta 2 + 2 1 (Note 2)
Gold_Carbon Sputter Coater Quorum Tech Q150RES Rijuta 0.25 1 (Note 2)
ELECTRICAL TEST
Probe Station Yusha 0.5 1
CV Plotter Yusha 0.5 1

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